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    • 专利摘要:
    PURPOSE: Compounds containing vinyl silane and electron donor or acceptor functionality are provided. The compounds are useful in adhesives applications, and produce adhesive facilitating agent or hardening resin with improved adhesive strength. CONSTITUTION: The compounds having the structure of the formula are provided, wherein m and n independently are 0, 1, 2 or 3, provided that both of them are not 0 simultaneously; q is 1 or 2; p is 0, 1 or 2; X and X' independently are -O-, -NH- or -N-Si-; R and R1 independently are alkyl, cycloalkyl or aromatic group; R2 is vinyl, alkyl, cycloalkyl or aromatic group; and E and E' independently are selected from maleimide, fumarate, maleate, vinyl ether, styrene and vinyl silane groups.
    公开号:KR20040069402A
    申请号:KR1020030005755
    申请日:2003-01-29
    公开日:2004-08-06
    发明作者:무사오사마엠.
    申请人:내쇼날 스타치 앤드 케미칼 인베스트멘트 홀딩 코포레이션；
    IPC主号:
    专利说明:

    COMPOUNDS CONTAINING VINYL SILANE AND ELECTRON DONOR OR ACCEPTOR FUNCTIONALITY}
    [1] The present invention relates to compounds containing vinyl silanes and electron donor or electron acceptor functional groups, which can be used in adhesion promoters or curing compositions.
    [2] Adhesive compositions are used in the fabrication and assembly of semiconductor packages and microelectronic devices, such as coupling integrated circuit chips to lead frames or other substrates, and coupling circuit packages or assemblies to printed circuit boards. The lead frame can be made of 42Fe / 58Ni alloy (Alloy 42), copper or silver or palladium coated copper, and the circuit board can be made of ceramic or laminate, so a universal adhesive with good performance is one of these substrates. If used above, it may cause defect.
    [3] The addition of an adhesion promoter to such adhesive compositions or the use of cured resins containing adhesives that promote the performance of the adhesive may complement this deficiency.
    [4] It is an object of the present invention to provide a compound that can be used as an adhesion promoter or cured resin that does not lower the adhesive strength when used in one or more substrates.
    [5] The present invention relates to compounds containing both vinyl silane functional groups and electron donor or electron acceptor functional groups. In another embodiment, the present invention relates to an adhesive, coating or encapsulating agent composition containing a compound according to the present invention.
    [6] In one embodiment, the present invention relates to a compound having the structure:
    [7]
    [8] Where
    [9] m and n are independently 0, 1, 2 or 3, but neither can be 0
    [10] q is 1 or 2,
    [11] p is 0, 1 or 2,
    [12] X and X 'are independently -O-, , or ego,
    [13] R and R 1 are independently alkyl, cycloalkyl or aromatic groups,
    [14] R 2 is a vinyl, alkyl, cycloalkyl or aromatic group (which may be contained in small molecule components, oligomers or polymers);
    [15] E and E 'are independently electronic donors or electronic acceptors.
    [16] Suitable electron acceptors are for example maleimides, acrylates, fumarates and maleates. Suitable electron donors are, for example, vinyl double bonds of carbon and carbon outside the aromatic rings such as vinyl ethers, vinyl silanes, and styrene and cinnamil groups and conjugated with unsaturateds in the aromatic rings.
    [17] In another embodiment, the present invention relates to a curing composition such as an adhesive, coating or encapsulating agent containing the vinyl silane compound of the present invention. The composition may be in the form of a paste prepared by milling and mixing the components or in the form of a film produced by film production methods known to those skilled in the art. This curing composition may optionally comprise a curing agent and optionally a filler.
    [18] The vinyl silane compound may be a major component in the curing composition or may be added as an adhesion promoter or other cured resin. When used as an adhesion promoter, the content of the vinyl silane compound used in the curing composition is an effective amount to promote adhesion, and generally the effective amount will be in the range of 0.005 to 20.0 wt% based on the weight of the formulation.
    [19] Cured resins used as main components other than vinyl silanes according to the invention are attached to aromatic rings such as epoxy, electron donor resins (e.g., vinyl ethers, thiol-enes and compounds derived from cinnamil and styrene starting compounds and are aromatic). Examples thereof include a resin containing carbon and a carbon double bond conjugated with an unsaturated compound of a ring) and an electron acceptor resin (for example, fumarate, maleate, acrylate and maleimide).
    [20] Suitable curing agents are thermal initiators and photoinitiators present in an effective amount of the curing composition. Generally, such an effective amount is from 0.5% to 30% by weight, preferably from 1% to 20% by weight relative to the total weight of the organic material present in the composition (ie excluding all inorganic fillers). Preferred thermal initiators include peroxides such as butyl peroctoate and dicumyl peroxide and 2,2'-azobis (2-methyl-propanenitrile) and 2,2'-azobis (2-methyl-butanenitrile) It includes azo compounds such as. The photoinitiator is preferably marketed under the trade name Irgacure by Ciba Specialty Chemicals. In some formulations, both thermal initiators and photoinitiators may be preferred. That is, the curing process may be started by heat after irradiation or the curing process may be started by irradiation after heat. Generally the curing composition will cure within a temperature range of 70 ° C. to 250 ° C. and will last within 10 seconds to 3 hours. The actual curing profile will vary depending on the component and practitioners will be able to determine it without undue effort.
    [21] The formulation may further comprise a thermally conductive or electrically conductive or nonconductive filler. Suitable conductive fillers include carbon black, graphite, gold, silver, copper, platinum, palladium, nickel, aluminum, silicon carbide, boron nitride, diamond, and alumina. Suitable nonconductive fillers include vermiculite, mica, wollastonite, calcium carbonate, titania, sand, glass, fused silica, fumed silica, barium sulfate and tetrafluoroethylene, trifluoroethylene, vinylidene fluoride, Halogenated ethylene polymers such as vinyl fluoride, vinylidene chloride and vinyl chloride. If present, the filler will be from 20% to 90% by weight, based on the weight of the formulation.
    [22] Hereinafter, the synthetic method used to prepare the vinyl silane compound disclosed in the present invention, examples of the vinyl silane compound, and the performance of the curing composition will be described.
    [23] Synthetic process
    [24] Process 1
    [25] Reaction of vinyl silanes with alcohols or amines.
    [26] One molar equivalent of alcohol or amine and triethylamine are mixed in dry toluene at 0 ° C. and one molar equivalent of vinyl silane dissolved in toluene is added. The mixture is reacted for 4 hours at room temperature and the product is obtained after evaporating the solvent.
    [27] Process 2
    [28] Reaction of alkyl or alkenyl halides with phenols or acetoacetates.
    [29] One molar equivalent of phenol or acetoacetate is charged to a three necked flask equipped with a mechanical stirrer, a condenser, and an inlet / outlet tube for nitrogen. Methyl ethyl ketone is added and the reaction is carried out under nitrogen gas. Alkyl or alkenyl halides are added through the syringe and stirring is started. Potassium carbonate is added and the reaction mixture is heated at 50 ° C. for 11 hours, cooled to room temperature and vacuum filtered. The filtrate is washed with 5% NaOH and 10% Na 2 SO 4 . The organic layer is dried over MgSO 4 and the solvent is evaporated to yield the product.
    [30] Process 3
    [31] Reaction of amines with isocyanates.
    [32] One molar equivalent of isocyanate is solvated in toluene in a three necked flask equipped with a mechanical stirrer, addition funnel, and nitrogen inlet / outlet. The reaction is carried out under nitrogen and the solution is heated at 60 ° C. The addition funnel is charged with 1 molar equivalent of amine dissolved in toluene and this solution is added to the isocyanate solution over 10 minutes. The resulting mixture is heated at 60 ° C. for an additional 3 hours and cooled to room temperature. The solvent is removed in vacuo to yield the product.
    [33] Process 4
    [34] Reaction of alcohols with isocyanates.
    [35] One molar equivalent of isocyanate is solvated in toluene in a three necked flask equipped with a mechanical stirrer, addition funnel, and nitrogen inlet / outlet. The reaction is carried out under nitrogen and the dibutyltin dilaurate catalyst is added with stirring and the solution is heated to 60 ° C. The addition funnel is charged with 1 molar equivalent of alcohol dissolved in toluene. This solution is added to the isocyanate solution over 10 minutes and the resulting mixture is heated at 60 ° C. for an additional 3 hours. After cooling the reaction to room temperature, the solvent is removed in vacuo to yield the product.
    [36] Process 5
    [37] Reaction of amines or mercaptans with alkyl halides.
    [38] One molar equivalent of alkyl halide is solvated in THF in a three necked flask equipped with a mechanical stirrer and addition funnel. The addition funnel was charged with 1 molar equivalent of amine or mercaptan dissolved in THF and this solution was added to the alkyl halide solution at 0 ° C. over 10 minutes. The resulting mixture is stirred at rt for 12 h, the solvent is removed in vacuo and ether and water are added to the result. The organic layer is extracted, dried over MgSO 4 and the solvent is removed in vacuo to afford the product.
    [39] Example
    [40] Example 1
    [41]
    [42] To a 250 mL round Batak flask was added 1,4-butanediol vinyl ether (8.03 g, 0.07 mol), triethylamine (6.98 g, 0.07 mol) and toluene (50 mL). Trivinyl chlorosilane (10.00 g, 0.07 mol) was added dropwise through a slow-adding funnel at 0 ° C. (run in ice bath). Once addition was complete, the ice bath was removed and the mixture was stirred at rt for 4 h. The mixture was filtered and the filtrate was charged into a 250 ml round bottom flask. The solvent was removed under reduced pressure to give the product in 89% yield.
    [43] Example 2
    [44]
    [45] To a 250 mL round Batak flask was added 1,4-butanediol vinyl ether (7.69 g, 0.07 mole), triethylamine (6.67 g, 0.07 mole) and toluene (50 mL). Vinyl phenyl methyl chlorosilane (12.10 g, 0.07 mole) was added dropwise through a slow-adding funnel at 0 ° C. (run in ice bath). Once addition was complete, the ice bath was removed and the mixture was stirred at rt for 4 h. The mixture was filtered and the filtrate was charged into a 250 ml round bottom flask. The solvent was removed under reduced pressure to give the product in 90% yield.
    [46] Example 3
    [47]
    [48] To a 250 mL round Batak flask was added 1,4-butanediol vinyl ether (9.49 g, 0.082 mol), triethylamine (8.25 g, 0.082 mol) and toluene (50 mL). Diphenyl vinyl chlorosilane (20.0 g, 0.082 mol) at 0 ° C. (done in ice bath) was added dropwise through a slow-adding funnel. Once addition was complete, the ice bath was removed and the mixture was stirred at room temperature for 4 hours. The mixture was filtered and the filtrate was charged into a 250 ml round bottom flask. The solvent was removed under reduced pressure to give the product in 86% yield.
    [49] Example 4
    [50]
    [51] This compound is prepared by reacting 1,4-butanediol vinyl ether with dimethyl vinyl chlorosilane according to step 1.
    [52] Example 5
    [53]
    [54] Reaction of trivinyl chlorosilane with N-methylolmaleimide (prepared according to J. Bartus, WL Simonsick and O. Vogl, JMS-Pure Appl. Chem. , A36 (3) , 355, 1999) according to process 1 To prepare this compound.
    [55] Example 6
    [56]
    [57] Diphenyl vinyl chlorosilane and N-methylolmaleimide (prepared according to Process 1 according to J. Bartus, WL Simonsick and O. Vogl, JMS-Pure Appl. Chem. , A36 (3) , 355, 1999) By reaction to prepare this compound.
    [58] Example 7
    [59]
    [60] This compound is prepared by reacting cinnamil alcohol with dimethyl vinyl chlorosilane according to step 1.
    [61] Example 8
    [62]
    [63] According to Step 1, cinnamic alcohol and trivinyl chlorosilane are reacted to prepare this compound.
    [64] Example 9
    [65]
    [66] This compound is prepared by reacting isoeugenol and diphenyl vinyl chlorosilane according to Step 1.
    [67] Example 10
    [68]
    [69] According to Step 1, isoeugenol and methyl vinyl chlorosilane are reacted to prepare this compound.
    [70] Example 11
    [71]
    [72] According to Step 1, isoeugenol and trivinyl chlorosilane are reacted to prepare this compound.
    [73] Example 12
    [74]
    [75] This compound is prepared by reacting cinnamil alcohol with methyl vinyl dichlorosilane according to step 1.
    [76] Example 13
    [77]
    [78] This compound is prepared by reacting cinnamil alcohol with methylvinyl dichlorosilane according to Step 1 and then reacting 1,4-butanediol vinyl ether.
    [79] Example 14
    [80]
    [81] This compound is prepared by reacting 1 molar equivalent of cinnamic amine with 1 molar equivalent of trivinyl chlorosilane according to Step 1.
    [82] Example 15
    [83]
    [84] According to step 1, 1 molar equivalent of cinnamic amine and 2 molar equivalent of trivinyl chlorosilane are reacted to prepare this compound.
    [85] Example 16
    [86]
    [87] This compound is prepared by reacting isoeugenol and 1-bromo propanol according to step 2 and then reacting trivinyl chlorosilane according to step 1.
    [88] Example 17
    [89]
    [90] The compound is prepared by reacting m-TMI with ethanol amine according to Step 3, followed by diphenyl vinyl chlorosilane according to Step 1.
    [91] Example 18
    [92]
    [93] The compound is prepared by reacting m-TMI with ethylene glycol according to step 4, followed by diphenyl vinyl chlorosilane according to step 1.
    [94] Example 19
    [95]
    [96] According to step 1, ethylene glycol and trivinyl chlorosilane are reacted to prepare this compound.
    [97] Example 20
    [98]
    [99] This compound is prepared by reacting cinnamil bromide with ethanol amine according to step 3 and then reacting 1 molar equivalent of trivinyl chlorosilane according to step 1.
    [100] Example 21
    [101]
    [102] This compound is prepared by reacting cinnamil bromide with ethanol amine according to step 5 and then reacting 2 molar equivalents of trivinyl chlorosilane according to step 1.
    [103] Example 22
    [104]
    [105] This compound is prepared by reacting 4-vinyl benzyl chloride and ethanol amine according to step 5 and then reacting 2 molar equivalents of trivinyl chlorosilane according to step 1.
    [106] Example 23
    [107]
    [108] The compound is prepared by reacting cinnamil alcohol with vinyltrichlorosilane according to Step 1.
    [109] Example 24
    [110]
    [111] According to step 1, 1,4-butanediol vinyl ether is reacted with vinyltrichlorosilane to prepare this compound.
    [112] Example 25
    [113] Performance data
    [114] An adhesive was prepared comprising bismaleimide, a compound having cinnamil functionalities, an epoxy, a curing agent, and 75 weight percent silver. Vinyl silane compounds (including those sold as controls) and the compounds obtained in Examples 1, 2, and 3 were added to this composition in 1% by weight and each composition was tested for adhesive strength as an adhesive for die attachment.
    [115] This adhesive was applied at 650 × 650 mil on a silver-coded leadframe with die pads. A 500 × 500 mil silicon die was left on the adhesive and the adhesive was cured in an oven at 175 ° C. for 30 minutes. The cured assembly was subjected to 85 ° C./85% relative humidity for 48 hours. The die was stripped at 90 ° from the leadframe with a Dage 2400-PC Die Shear Tester at 250 ° C.
    [116] Ten assemblies were tested for each adhesive composition and the results are expressed as the average of Kilogram force. The results show that addition of the compound of the present invention to the cured composition under the above conditions, as described in the following table, shows that the adhesive strength is improved or at least equivalent to that of commercially available vinyl silane (SID-4608 from Gelest, Inc.). Is shown.
    [117] Vinyl silaneDie Shear Strength KgF No addition20.1 SID-460828.6 Compound of Example 136.0 Compound of Example 230.3 Compound of Example 333.5
    [118] The compounds of the present invention have been added to the cured compositions so that the adhesive strength is improved or at least equaled compared to conventional cured compositions.
    权利要求:
    Claims (5)
    [1" claim-type="Currently amended] Compound represented by the following structural formula:

    Where
    m and n are independently 0, 1, 2 or 3, but neither can be 0
    q is 1 or 2,
    p is 0, 1 or 2,
    X and X 'are independently -O-, , or ego,
    R and R 1 are independently alkyl, cycloalkyl or aromatic groups,
    R 2 is a vinyl, alkyl, cycloalkyl or aromatic group;
    E and E 'are selected from the group consisting of maleimide, fumarate, maleate, vinyl ether, styrene and vinyl silane groups.
    [2" claim-type="Currently amended] The method of claim 1,
    n is 0; m and q are 1; p is 2; X is oxygen; R 2 is vinyl, alkyl, or aromatic; R is alkyl; E is a vinyl ether.
    [3" claim-type="Currently amended] The method of claim 1,
    The structural formula Phosphorus compounds.
    [4" claim-type="Currently amended] The method of claim 1,
    The structural formula Phosphorus compounds.
    [5" claim-type="Currently amended] The method of claim 1,
    The structural formula Phosphorus compounds.
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    同族专利:
    公开号 | 公开日
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    法律状态:
    2003-01-29|Application filed by 내쇼날 스타치 앤드 케미칼 인베스트멘트 홀딩 코포레이션
    2003-01-29|Priority to KR1020030005755A
    2004-08-06|Publication of KR20040069402A
    优先权:
    申请号 | 申请日 | 专利标题
    KR1020030005755A|KR20040069402A|2003-01-29|2003-01-29|Compounds containing vinyl silane and electron donor or acceptor functionality|
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